GT Advanced Technologies: Is Ready to Electrify the Mobile World

Posted: March 3, 2014 by mattmargolis24 in My Publications, Solar News
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Matt Margolis 3/3/14

GT Advanced Technologies’ (GTAT) epitaxial growth on thin lamina patent was published on 2/6/14. Epitaxy is defined as the growth of a thin layer on the surface of a crystal so that the layer of growth has the same structure as the underlying crystal. GT’s patent essentially enables the growth of a semiconductor material on a donor body, by firing GT’s Hyperion’s ion cannon which splits (exfoliates) the semiconductor material from the donor body, to form a super thin lamina (layer) of the semiconductor material. The resulting lamina from the first process can be exfoliated by Hyperion a second time to form an additional semiconductor lamina. The patent can be applied across a broad range of semiconductor materials to epitaxally grow GaN, AlGaN, AN, Ge, Ga(In)As, GaInP, AlGaInP, AlInP, InGaN, SiC, GaAs. The epitaxial layer may be doped as either n-type or p-type while it is being grown. The donor bodies for this patent include germanium, gallium arsenide, silicon carbide, silicon and gallium nitride.

One of the most interesting findings within this patent was related to PV (photovoltaic), specifically the creation of a triple junction PV cell and the ability to incorporate the thin (PV cell) lamina into an electronic device. Not only does GT have the ability to create thin film solar cells but they also have the ability to stack the thin film solar cells to form a triple junction PV cell that is still less than 25 microns thick before it is incorporated into an electronic device all while rocking a 40%+ efficiency rating. Below are some details from the epitaxial growth on thin lamina patent.

For the complete article head over to Seeking Alpha (membership is free)


  1. Barry Fitzgerald says:

    Depending on costs to do this, GTAT could totally rock the PV industry if they could make triple jcn large format solar cells approaching 40%. My concern is the complexity of the process. You have to make 3 substrates, form devices on all three, then interconnect them together in an economically feasible manner. I believe, not sure, that triple junction cells today are grown on a single substrate and have a single interconnection mechanism. Still , material costs dominate so perhaps materials savings will offset mechanical interconnect issues.


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